MCP604T-I/ST Microchip Technology IC OPAMP GP 2.8MHZ RRO 14TSSOP

label:
2025/01/9 37
MCP604T-I/ST  Microchip Technology IC OPAMP GP 2.8MHZ RRO 14TSSOP


• Single-Supply: 2.7V to 6.0V
• Rail-to-Rail Output
• Input Range Includes Ground
• Gain Bandwidth Product: 2.8 MHz (typical)
• Unity-Gain Stable


CATALOG
MCP604T-I/ST PARAMETRIC INFO
MCP604T-I/ST PACKAGE INFO
MCP604T-I/ST MANUFACTURING INFO
MCP604T-I/ST PACKAGING INFO
MCP604T-I/ST ECAD MODELS
MCP604T-I/ST APPLICATIONS


PARAMETRIC INFO
Manufacturer Type Low Power Amplifier
Type Low Power Amplifier
Rail to Rail Rail to Rail Output
Number of Channels per Chip 4
Minimum Single Supply Voltage (V) 2.7
Process Technology CMOS
Minimum PSRR (dB) 80
Typical Single Supply Voltage (V) 3|5
Output Type CMOS
Maximum Single Supply Voltage (V) 6
Typical Gain Bandwidth Product (MHz) 2.8
Maximum Quiescent Current (mA) 1.3@5.5V
Maximum Input Offset Voltage (mV) 2@5.5V
Maximum Input Offset Current (uA) 0.000001(Typ)@5.5V
Maximum Input Bias Current (uA) 0.00006@5.5V@85C
Maximum Operating Supply Voltage (V) 6
Maximum Supply Voltage Range (V) 6 to 9
Minimum CMRR (dB) 75
Minimum CMRR Range (dB) 75 to 80
Typical Voltage Gain (dB) 115
Typical Slew Rate (V/us) 2.3@5.5V
Typical Settling Time (ns) 4500
Typical Output Current (mA) 30(Max)
Typical Input Noise Voltage Density (nV/rtHz) 29@5.5V
Typical Input Bias Current (uA) 0.000001@5.5V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.0006@5.5V
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Power Supply Type Single


PACKAGE INFO
Supplier Package TSSOP
Basic Package Type Lead-Frame SMT
Pin Count 14
Lead Shape Gull-wing
PCB 14
Tab N/R
Package Length (mm) 5
Package Width (mm) 4.4
Package Height (mm) 1
Package Diameter (mm) N/R
Mounting Surface Mount
Package Description Thin Shrink Small Outline Package
Package Family Name SO
Jedec MO-153AB-1
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix T
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Tape Pitch (mm) 8
Tape Width (mm) 16
Component Orientation Q1
Packaging Document Link to Datasheet
Tape Type Embossed


ECAD MODELS



APPLICATIONS
• Portable Equipment
• A/D Converter Driver
• Photo Diode Pre-amp
• Analog Filters
• Data Acquisition
• Notebooks and PDAs
• Sensor Interface
Termék RFQ